This entry was posted on Friday, January 5th, 2007 at 10:46 pm and is filed under PCB News. You can follow any responses to this entry through the RSS 2.0 feed. You can leave a response, or trackback from your own site.
While notebooks become more miniature, it draws more printed circuit board (PCB) makers to produce notebook-use PCBs using high-density interconnect (HDI) technology.
Currently, HDI boards are mainly utilized in high-end notebooks, and Japan players lead the industry in the adoption of HDI boards, usually with 6 to 8 layers. In addition to the laptop size, thinner PCBs also help notebook vendors to get a larger space for battery.
All major Taiwan PCB makers, including Compeq Manufacturing, Unitech Printed Circuit Board, Unimicron Technology and Wus Printed Circuit, have already started deploying HDI technology in notebook-use PCB production.
According to Compeq, its initial shipments of notebook-use HDI PCBs are limited, and the company holds a conservative outlook for the near future. Gold Circuit Electronics (GCE), on the other hand, anticipates notebook HDI PCBs to contribute 10% to its revenues in 2007, up from 4% last year.
source: DigiTimes